Magillem at ChipEx, May 9-10, 2017

ChipEx, May 9-10, 2017, Israel Trade Fair Center, 101 Rokach Blvd, Tel Aviv (Israel), Booth #G1

Magillem, the leading XML-based Front-end design solutions provider, exhibits on booth #G1, at Israel Trade Fair Center, Tel Aviv (Israel), May 9-10, 2017.

ChipEx is the leading international event of the Israeli semiconductor industry. Its goal is to update all professionals involved in the Israel microelectronics industry with the latest technological innovations and future direction of the industry.

With its innovative vision, called ISDD© for “Integrating Specification, Design, and Documentation”, Magillem addresses the needs of major industry players for today and tomorrow. Thanks to ISDD© , software architects, designers, validation teams, developers and technical writers remain in synch all along the product design cycle through a hub of semantic links that connects together all design/product content pieces.

To get a presentation and/or a demonstration of Magillem ISDD© methodology, we welcome you on booth #G1. To schedule a meeting, please email us your request at : contact@magillem.com.

Contacts

■ Vincent Thibaut
thibaut@magillem.com

■ David DE PAULA
depaula@magillem.com
chipex01
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